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IEUVI
RESIST TWG Meetings
October 20, 2011
2011 IEUVI Resist TWG and Agenda by Karen Petrillo, Patrick Naulleau and Serge Tedesco, SEMATECH
Presentations
E-beam and EUV Lithography Performance Comparison by Greg Wallraff, IBM
Outgas from EUV Resist Materials Irradiated with EUV and 2 keV Electrons by Seiichi Tagawa, Osaka University
Outgas Research Activity in EIDEC by Soichi Inoue, EIDEC
E-beam and EUV Lithography Performance Comparison by Noreen Harned, ASML
Witness Sample Based Resist Outgas Test Report
CNSE ROX Outgassing Tool by Greg Denbeaux, CNSE
NIST witness-plate testing by Charles Tarrio, NIST
Update on EUV Outgassing at IMEC by Ivan Pollentier, IMEC
EUV resist outgassing and witness plate contamination testing tool RER-300PEX by Rupert Perera, EUV Technology
February 27, 2011
2011 IEUVI Resist TWG Agenda by Karen Petrillo, SEMATECH
Presentations
2011 Resist TWG Introduction by Karen Petrillo, SEMATECH
EUV Resists Considered as Materials for Optics by Tom Wallow, GLOBALFOUNDRIES
Resist process and Etch process techniques for LWR reduction by Shinichiro Kawakami, TEL
Development of Under Layer material for EUV Lithography by B.C. Ho, Nissan
EUV resist outgassing update by Greg Denbeaux, CNSE
Development of Under Layer material for EUV Lithography by I. Pollentier, IMEC
NIST programs in photoresist outgassing and optics damage by C. Tarrio, NIST
October 17, 2010
2010 Resist TWG Intro and Agenda by Karen Petrillo, SEMATECH
Presentations
Trade-off Problems among Resolution, LWR and Sensitivity of EUV Resists by Seiichi Tagawa, Osaka University
EUV resist challenges of image collapse, LWR, sensitivity, and resolution by Jim Thackeray, DOW
EUV Resist Development toward 22nmhp Design and Beyond by Toru Kimura, JSR
Approaches to address the EUV resist challenges of image collapse, LWR, sensitivity, and resolution by Shinji Tarutani, Fuji
AZ EUV UL Overview by Mark Neisser, AZ
Tooling to measure EUV resist outgassing and witness plate contamination by Rupert Perera, EUV Technology
Witness Plate Testing and electron versus EUV outgassing by Greg Denbeaux, CNSE
Resist Outgas Testing by Noreen Harned, ASML
February 26, 2009
Welcome, Agenda, & Focus topic: Addressing Pattern Collapse in EUV by Jacque Georger, SEMATECH
Presentations
Challenges Associated with Line Pattern Collapse for EUV Lithography by Steve Scheer, Tokyo Electron America
EUV Resist Pattern Collapse Status by Chawon Koh, SEMATECH
Resist Pattern Collapse & Failure: Quantifying the Problem & Ways to Solve It by Clifford Henderson, Ga. Tech. Univ.
How and Why Does Pattern Collapse Occur? by Jun Iwashita, TOK
Resist Materials Issues Beyond 22nm hp Patterning for EUV Lithography by Shinji Tarutani, Fujifilm
Resist Outgassing WG Intro by Emil Piscani, SEMATECH
OS1 Resist Outgassing Results at Multiple Sites by Chimaobi Mbanaso, CNSE
October 02, 2008
Welcome & Agenda by Serge Tedesco, CEA/LETI
Focus Topic Intro: What are Keys to Optimizing RLS? by Jacque Georger, SEMATECH
Presentations
Resist Based Dose Calibrations Update by Noreen Harned, ASML
Optimizing RLS by Seiichi Tagawa, Osaka Univ./JST-CREST
Fullerene Resists - Optimizing RLS by Alex Robinson, Univ. of Birmingham
Optimizing RLS by Naoto Ohshima, FujiFilm EM
RLS Trade-Off: Questions about Molecular Size & Quantum Yield by Robert Brainard,
CNSE, U. Albany
RLS Optimization KLUP to Understand Trends by Mieke Goethals, IMEC
Optimizing RLS by Todd Younkin, Intel
February 28, 2008
Presentations
Agenda, Introduction by K. Dean, SEMATECH and S. Tedesco, CEA/LETI
Tool Dose Calibration by P. Naulleau, LBNL
Shot Noise by C. Szmanda, Rohm and Haas
Shot Noise by G. Gallatin, Applied Math Solutions
Shot Noise by Y. Gotkis, KLA-Tencor
Shot Noise by R. Bristol, Intel
Shot Noise by H. Smith, MIT
Shot Noise by F. Pease, Stanford
November 01, 2007
Agenda
Presentations
Welcome, Introductions
Resist Technical Working Group by K. Dean
IMEC Update by A M Geothals
Brewer Science by J. Makos
Dynamics of Chemical Intermediates in CARs of Post-optical Lithographies by A. Saeki
Update from More Moore by S. Tedesco
Regional Update Selete by T. Itani
Regional Update Selete by K. Dean
Albany EUV MET by D. Stark
EUV Exposure Tool by J. Hartley
EUV Interference Lithography at PSI by H. Solak
Tool Dose Calibration by R. Brainard
Required Resist Performance for 32, 22 & 16nm hp based on a single Figure of Merit by K. Van Ingen Schenau
Wrap Up by S. Tedesco
March 01, 2007
Agenda
Presentations
Japan Update By I. Nishiyama, ASET
IMEC Update By R. Gronheid, IMEC
More Moore Update By K. Tedesco, CEA/LETI
US Update By K. Dean, Sematech
Tool Dose Calibration By R. Brainard, University of Albany
22nm Resist Development By T. Kozawa, Osaka University
LER/LWR Measurements By P. Naulleau, LBNL/University at Albany
Resist Specification Roadmap Dicussion By K. van Ingen Schenau, ASML
Wrap Up By S. Tedesco, CEA/LETI
October 19, 2006
Agenda
Presentations
International EUV Initiative Resist Technical Working Group By K. Dean
Review of Resist Outgassing Round Robin & Some Comments By I. Nishiyama
Wrap Up By S. Tedesco
U.S. & Sematech Update By K. Dean
EUV Resist Funding Gap Analysis By K. Dean
Measurements of HC Levels in Stepper Vacuums By A. Keen
New Method for Resist Outgassing Qualification By B. Wolschrijn
Acceptable Photoresist Outgassing By T. Aoki
Witness Plate Testing: the convergence of resist outgassing & optics contamination By G. Denbeaux
Contamination Removal of EUVL Masks & Optics Using 13.5-nm & 172-nm Radiation By T. Watanabe
Dose Calibrations for EUV Exposure Tools By R. Brainard
February 23, 2006
Agenda
Presentations
8th International EUV Initiative Resist Technical Working Group By K. Dean, S. Tedesco
Outgassing Measurement in the University of Hyogo (NewSUBARU) By T. Watanabe, H. Kinoshita
Comments on Resist Outgas Measurements to remove the confusion in outgassing discussion By I. Nishiyama
ASET Update for IEUVI Resist TWG meeting By H. Oizumi
Status of ASET-Outgassing evaluation By H. Oizumi
IEUVI Resist TWG By M. Goethals
Update from More Moore By S. Tedesco
University of Wisconsin EUV Exposure Stations By P. Nealey
EUV Resist Specification Roadmap By Hah (Samsung)
EUV Resist Screening Data Table By Leeson (Intel)
TOK Resist Development Status for EUV Lithography By K. Ohmori
IEUVI TWG Update-Resist Evaluation By T. Wallow, B. Lafontaine
Electrodelss Z-Pinch EUV source for Resist Outgassing & Exposure Studies By P. Blackborow
Tools for "In-House" Resist Characterization under EUV exposure By C. Wies, R. Lebert
EUV Stimulated Photoresist Outgassing By C. Hughes
Brief Regional Update: MEDEA Excite project By M. Goethals
November 10, 2005
Agenda
Presentations
Welcome & Introductions of Charter, Goals for Resist TWGs By Dean
Outgassing Round Robin Results By Intel/Yeuh
Outgassing Round Robin Results By H. Oizumi
Outgassing Round Robin Results By C. Vannuffel
Resist Round Robin Outgassing @ ELETTRA By M.Bertolo, P. Lacovig, L. Rumiz, D. Giuressi, R. Sergo, A. Stolfa
Update Japan/ASET By H. Oizumi, ASET
Update from More Moore By S. Tedesco
Update from MEADE/EXCITE By M. Goethals
Update from US/SEMATECH By K. Dean
New Areas for TWG Cooperation By S. Tedesco
Feedback on the ITWG Resist consortia cooperation proposal By P. Zanbergen
EUV Resist Specification Roadmap - Revised
IEUVI Resist Technical Working Group By A. Keen
March 03, 2005
Agenda
Presentations
IEUVI Resist Summary for March 4 IEUVI Meeting By Dean
Introduction to March 3 IEUVI Resist TWG Meeting By Dean
Feedback from 1st European on Resist LimitaionsBy Wolf-Dieter Domke, Infineon
Feedback from SEMATECH LER & Resist Limitation Workshops By Kim Dean
Brief Description of Outgassing Methods (5 min each) By Domke
Brief Description of Outgassing Methods (5 min each) By Keen
Brief Description of Outgassing Methods (5 min each) By Vannuffel
Brief Description of Outgassing Methods (5 min each) By Nishiyama
Brief Description of Outgassing Methods (5 min each) By Dean
Outgassing Discussion Notes By Dean
Resist Outgassing; compare methods & explore areas of cooperation By Wolf-Dieter Domke
Revised Resist Specifications By Dean
Update Japan/ASET By Iwao Nishiyama, ASET
Update from More Moore By Serge Tedesco, CEA/LETI
Update from MEADEA/EXCITE By Wolf-Dieter Domke
Update from US/SEMATECH By Kim Dean
Three Topics for TWG Cooperation By Serge Tedesco
Comparison of Resist Performance at LBNL Microstepper & PSI Interference Setup By Roel Gronheid
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