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IEUVI
MASK TWG Meetings
October 16, 2011
Mask TWG Handling Summary - Action Items
IEUVI Mask TWG Agenda
Opening and Closing Remarks By David Chan, SEMATECH
EUV Mask Standards Update By Long He, SEMATECH/Intel
EUV Pod development and
evaluation update By Chenwei Ku, Gudeng
Entegris EUV pod status and update By Tom Kielbaso, Entegris
Nikon/Canon Perspectives of Potential Improvement of Pod Performance By Kazuya Ota, Nikon
Issues of Reticle Coatings and Reticle Edge Tolerance in Pod By Kazuya Ota, Nikon
Automation Challenges of EUV Reticle carriers By Katsushi Hayasaki, Rorze Corporation
Qualification of particle free EUV equipment By Jacques van der Donck, TNO
EUV Carrier implementation to the mask tool By Hiroki Miyai, Lasertec
Initial Learning of In-Fab Handling (of EUV Reticles) By Rik Jonckheere, IMEC
Discussions
EUV mask cleaning challenges for 16 nm and 11 nm HP nodes By Abbas Rastegar, SEMATECH
EUV mask cleaning: challenges and solutions By Takeya Shimomura, Dai Nippon
Programmed and Native Defect Printability By Hyuk Joo (Harry) Kwon, SEMATECH
IMEC Inputs on Blank Defectivity By Rik Jonckheere, IMEC
Sources of defects in EUV Mask blanks By Vibhu Jindal, SEMATECH
Defect Reduction beyond 32nm By Jeff Blouse, ASNA
Detection of small size particles in low pressure and for component evaluation By Gregory Denbeaux, CNSE
Modeling Particle Transport in Low Pressure Under Plasma Conditions By Alexandre Likhanskii, Tech-X
September 18, 2011
Presentations
Opening and Closing Remarks By D. Chan
EUV Mask Standards Update By L. He and D. Chan
EUV Mask Handling By N. Hayashi
Maskshop Implementation Discussions By L. He and D. Chan
February 27, 2011
Presentations
Opening and Closing Remarks By D. Chan
Defect Reduction Update By F. Goodwin
Comparison of Measured Integrated Reflectivity with Spectral Parameters By R. Perera
EUV Reticle Handling Implementation ─ Discussion Topics
Proposal for Total Reflectivity Uniformity of EUV Mask Multilayer Coatings By J. Zimmerman
Standard Revision: SEMI P37-1109 Specification for EUVL Substrates and Blanks By J. Zimmerman et al.
E152 Standard Revision: EUV-pod Reticle Carrier By L. He et al
October 21, 2010
Presentations
Opening and Closing Remarks By D. Chan
Mask Readiness Survey By D. Chan
E152 Standard Revision: EUV-Pod Reticle Carrier
P48 Fiducial Mark Standard Update
Proposed Changes to P-37 By D. Chan and J. Zimmerman
Reticle Handling / Shipping / Storage By L. He, G. Huang and D. Chan
February 21, 2010
Presentations
Opening Statements By D. Chan, SEMATECH
EUV Pods By G. Huang, SEMATECH
Sidewall Deposition – EUV Mask Blank By F. Goodwin, SEMATECH
ML Defect Integrated Solution Demonstration By P.Y. Yan, Intel
SEMI 4580 Ballot: Specification of Fiducial Marks By L. He
October 22, 2009
Presentations
Opening Statements By D. Chan, SEMATECH
Review / Discussion of 4584B By T. Hagiwara, Nikon; G. Huang, SEMATECH; A. Miyake, Canon; K. Ota, Selete and J. Zimmerman, ASML
SEMI P37 Status By D. Chan, SEMATECH; K. Orvek, SEMATECH; J. Zimmerman, ASML; T Hagiwara, Nikon; A. Miyake, Canon; K. Ota, Selete; Y. Ikuta, AGC and T. Shoki, HOYA
Fiducial Mark for Defect Mitigation Technology By S. Huh, D. Chan, G. Huang, SEMATECH; P.Y Yang, L. He, Intel and H. Han, Samsung
Strawman Alignment Error Budgets for Implementing Fiducial Marks By ASML
Flatness Compensation Updates/Challenges By J. Sohn, SEMATECH
ITRS Roadmap Update for EUV Masks
Proposal for Total Reflectivity Uniformity of EUV Mask Multilayer Coatings By J. Zimmerman, ASML
Defectivity Budget By D. Chan, G. Huang, SEMATECH
Panel Discussion
Welcome to Panel
Thoughts on Defect Printability Masks By B. La Fontaine, O. Wood, GLOBALFOUNDRIES; J. H. Peters, AMTC
Buried Defects Investigated with Simulation By C. Clifford, UC Berkeley
EUV Mask Defect Printability Standardization By R. Jonckheere
Defect Printability Mask Standardization -- Attributes and Possibility By S. Huh, SEMATECH/Samsung
Defect Printability Mask Standardization Attributes and Possibility By T. Liang, Intel
Defect Printability Mask Standardization -- Attributes and Possibility By Selete
February 22, 2009
Presentations
Introduction and Greetings By K. Orvek, SEMATECH
SEMI Standards Updates By L. He, Intel, J. Zimmerman, ASML and K. Orvek, SEMATECH
ITRS Roadmap, Specifications for EUVL Masks 2010-2012
Review Mask Infrastructure Readiness Survey Results By K. Orvek, SEMATECH
Focus Topics: Mask Defect Density
Blank Defects By H. Yun, SEMATECH
Real-World Printing of EUV Mask Defects By O. Wood, AMD
Covering Defects -- Fiducial Status By S. Huh, SEMATECH
Wrap Up and Plans for Next TWG Meeting By K. Orvek, SEMATECH
October 2, 2008
Presentations
Agenda
EUV Mask Standards Update
EUV Mask Readiness: Pilot Line 2010 - 2012
EUV Mask Thermal Overlay Analysis
Incidence Angle to EUV Mask
Illumination Angle Change -- Why and When
Reticle Fiducial Mark Positioning
February 28, 2008
Presentations
Agenda By K. Orvek
IEUVI Standards By K. Orvek, J. Zimmerman, R. Engelstad
ASML Standards Supplemental By J. Zimmerman
Selete By M. Amemiya
SEMATECH By L. He
University of Wisconsin By R. Engelstad
Selete By K. Ota
November 01, 2007
Presentations
International EUV Initiative (IEUVI) Mask Technology Working Group (TWG) Report to IEUVI Board By P. Seidel, SEMATECH
Attendance Report By K. Orvek, Intel/SEMATECH
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